Chinese flash memory maker claims breakthrough – QLC NAND matches endurance of TLC NAND

Chinese flash memory maker claims breakthrough – QLC NAND matches endurance of TLC NAND

March 28, 2024



Typically, the more charges a NAND flash cell can hold, the less durable it is in terms of program/erase cycles. But 3D NAND material innovations, advancements of NAND controllers, and error correction algorithms can significantly increase the number of P/E cycle a NAND flash cell can sustain. This is what happened with Yangtze Memory Technologies Co.’s X3-6070 3D QLC device that boasts the endurance of 3D TLC ICs, ITHome reports. 

YMTC’s X3-6070 3D QLC NAND device belongs to the company’s fourth Generation products and features 128 active layers as well as Xtacking 3.0 architecture with a 2400 MT/s interface. While 128 active layers do not seem like a record by today’s standards, one of the key part about this 3D QLC NAND device is that the manufacturer claims rather significant endurance of 4,000 program/erase cycles for this IC. The fast interface supported by these devices makes them suitable for the best SSDs featuring a PCIe 4.0 or PCIe 5.0 interface. 



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